A revolution in high-density measurement The MicronX System CXR platform is the world's first optically collimated console micro-beam XRF (MXRF) tool. The CXR utilises exclusive Optical Elements™ to produce 20-100 micron measurement beams capable of simultaneous multiple metal stack film thickness and composition determination. The tool is designed for measurements on wafers, optical devices, and high density packaging and substrate applications. Typical metal film measurements include Au, Pd, Ni, Sn, Sn-Pb, Pt, Va, Ge, Ti, Al, P, Cu, Cr and Fe. The use of optically collimated x-rays delivers precision gains of up to 1000 times that of prior tool technology. This allows rapid non-contact non-destructive metal film measurement in production. The CXR's revolutionary beam generator redirects and focuses x-rays to form a super intense x-ray beam resulting in an exceptionally brilliant micro-spot light source at the sample interface. This dramatically reduces measurement time while greatly increasing accuracy, precision and reproducibility.

Flexible process metrology

• Semiconductor device and wafer-level metallizations
• Interconnect metallurgy of flip-chip and BGA bumps and under bump metallurgy
• Metal films on chip carriers and lead frames
• Microelectronic metal depositions on connectors and passive devices
  
  Process control on production products
  
  The CXR tool allows an X-ray beam to be concentrated on a 20-100 micron structure with 10,000X the intensity of any other X-ray tool. This offers fast, accurate and reproducible Angstrom-level precision on nanometer range films on production products.
  
  Speed. Precision. Accuracy
  
  Thermo NORAN offer a wide range of X-ray metrology tools using the X-ray flourescence (XRF) non-contact, non-destructive metrology technique that is well suited to thin film measurement applications.