In-Situ Thickness Measurement System IsTMS

TEVET's In-Situ Thickness Measurement System IsTMS is an advanced thickness measurement system enabling integrated or in-situ solutions through seamless integration of the metrology module directly into the processing equipment. Ease of integration is enabled through Tevet's new proprietary measurement technology. This technology allows implementation of unique film thickness measurement solutions on product wafers with complex topography and stacked films structures.

Measurement capabilities

Tevet's thickness de-convolution method™ enables simultaneous measurements of multiple films in dense multi-stacked structures. The algorithm separates the multiple signals collected from the wafer and provides separate measurement results related to each of the different films. IsTMS measurement performance on product wafers matches measurement results obtained with traditional stand alone measurement tools. IsTMS provides integrated and in-situ solutions for transparent layers such as:

• Thermally grown or CVD deposited silicon oxide and silicon nitride films
• Photo-resist
• Spin-on dielectrics (SOD)
• Low-K dielectrics

Measurement technology

Tevet's thickness de-convolution method™ addresses the special requirements needed for advanced process control using in-situ or integrated metrology. Tevet's solution relies on rapid large spot size broad band spectral reflectometry using multiple optical sensors positioned above the processed wafer. Multi-point measurements are performed simultaneously.

Large measurement spot size, rapid signal acquisition and analysis combined with Tevet's proprietary algorithms allow for dynamic measurement on product wafers either static or during linear or rotational motion. This approach makes the measurement immune to noise, vibration or accuracy of position. It also eliminates the need for vibration isolation, auto-focus, pattern recognition and accurate stage movement, thus dramatically reducing cost of ownership.