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Wafer Mounters
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Wafer Die Matrix Expanders
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UV Curing Systems
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Cleaning Systems
FM-900S
Semi-Auto Wafer/Film Applicator
The
FM-900S is a semi-automatic system capable of laminating
film quickly onto wafer and dicing frame. The system
can be used with any dicing film and any frame.
Up
to 200mm (8in) wafers can be processed at a rate
of 120 per hour.
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Repeatable
and robust lamination processing of the wafer/film/dicing
frame
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No
skilled operator needed
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Bubble-free
lamination between wafer and the film
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Clean
cutting of remaining film
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Automatic
take up of protective film sheet
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Automatic
adjustment of parallelism between roller and
stage
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Adjustable
lamination speed of film
FM-114
The
FM-114 series of wafer/film applicators are quick,
easy-to-use, reliable systems for laminating film
on to wafers. No skilled operators are required.
Uses
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For
dicing and singulation
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For
back grinding and surface protection
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For
die-bonding or die-attach film lamination
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Two
rolls of film can be set for multi processing
Work
piece size
FM-1143
(Manual) Up to 300mm(12in)
FM-1148 (Manual) Up to 200mm(8in)
FM-1146 (Manual) Up to 150mm(6in)
Features
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Bubble-free
lamination between wafer and the film
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Film
cut integrity after laminating
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Roller
and work piece laminating operation in automatically
parallel system
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Adhesive
plastic film, UV film and special film are available
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Simple
mechanism, maintenance-free design
^Top
Die
Matrix Expanders
The
TEX series of die matrix expanders uniformly expand
diced and/or fractured wafers to produce the required
die interval. The systems significantly improve
chip and die handling after dicing.
Features
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Expansion ratio can be varied as necessary.
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Expansion
speed can also be varied.
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Equipped with a heated expansion stage, which
is helpful for high-ratio expansion.
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Expanded film and wafers can be gripped automatically.
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UV
Curing
These
UV curing systems are effective tools for reducing
the bonding strength of UV film used during dicing
and/or back grinding. The systems also makes it
easy to remove dies and/or wafers following UV irradiation.
UVC-108
(Low-pressure Hg Lamp Model)
Wafer size: up to 200mm(8in)
All the operator has to do is set and remove the
device. All other tasks are completed automatically.
Uniform irradiation from a dedicated light source.
350-400 nm wavelength
Space-saving tabletop model
Throughput
is 90 wafers/hour (Typical)
UVC-408
(High-pressure Hg Lamp Model)
Wafer
size: up to 200mm(8in)
All the operator has to do is set and remove the
device and open and close the device tray. All other
tasks are completed automatically.
High power irradiation by a high-pressure Hg lamp
Peak wavelength 365 nm
Space-saving tabletop model
Throughput
is 200 wafers/hour (Typical)
^Top
Cleaning
systems
A
variety of Technovision cleaning systems are available.
They include:
SMIF/Cassette
Cleaning System
The
TCC-801 can handle cassettes up to 200mm(8in). The
cleaning system addresses the increasingly demanding
requirements for cleaning SoC semiconductors, laser
devices, LEDs and MEMS devices.
The
small footprint system is designed specifically
for precision cleaning of wafer cassettes and boxes
with complex shapes.
Operating
capacity
150
mm cassette: 160 pcs/shift (8H)
200 mm cassette: 106 pcs/shift (8H)
Features
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The device can be rotated both clockwise and counter-clockwise.
Variable-angle spray washes every corner of the
cassette leaving no dead area.
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Washing
nozzle can be flexibly adjusted, enabling proper
washing for every device.
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Powerful jet sprays enable close washing.
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After large water drops are removed, the device
is transported to the dry chamber. Almost no water
is allowed into the dry chamber, keeping the humidity
low inside and ensuring a complete dry.
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Independent
washing and drying processing chambers are provided.
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Perfect
drying by a low flow of hot air and gentle rotation
of the device.
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Dry chamber is completely resistant to static
discharge.
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There is no friction or sliding in any step, from
loading, washing, rinsing, and water cutting to
drying and unloading, thus preventing particle
generation or secondary contamination.
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To
monitor real time cleaning performance, a liquid
particle counter can be attached.
Model
TFC-802
The
FOUP cleaning system is particularly well-suited
for precision cleaning of the 300 mm FOUP.
The
simple, compact structure of this cleaning system
utilizes Technovision's proprietary cleaning and
drying know-how.
Features
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The
upright design creates a small footprint.
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Simultaneous washing of FOUP unit and door possible.
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Oscillation is provided in two directions to enable
precise, even washing of the entire container.
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A powerful jet spray allows you to wash containers
up close.
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Features
independent washing and drying chambers, enabling
high throughput and continuous washing and drying.
UV-Ozone
Cleaning Systems
The
UV-Ozone Cleaning System effectively removes organic
contaminants on work surfaces, and can also be used
for surface modification. Easy to use, this system
features a simple structure for dry cleaning and
is best used in final cleaning.
Features
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Equipped with a high-density UV grid lamp
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Uniformly irradiates work surfaces
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Small,
compact design
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Used
in double-side and single-side cleaning
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No-hassle
operation with safety lock
Super
Clean Heater
The
Super Clean heaters heat the target instantaneously
without liquid contamination. The heater comes in
two types, the QH series and the SH series.
The QH series for ultra pure DI water is equipped
with pure quartz in the heating element, while the
SH series for clean dry air/inert gas is equipped
with electropolished 316L stainless steel in the
heating element. This heater is easy to install
in existing systems or lines.
For
ultra pure DI water (QH series)
Features
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16
models are available, with heating capacities
ranging from 1 to 36 KW.
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Wetted surfaces are made of only quartz and PTFE.
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Drift-water free construction.
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Compact,
safe, and durable design.
For
Inert Gas/Clean Dry Air (SH series)
Features
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6 models are available, with heating capacities
ranging from 500 to 2,400 W.
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The
heating section and fluid paths are made of electropolished
stainless steel.
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Featuring
a compact, safe, and highly efficient design.
