Wafer Inspection Systems 

The WAV 1000

The award winning  WAV-1000 is designed for pre and post probe wafer inspection applications with resolution requirements of 3µ or higher. This system also has options for pre and post bump (flip-chip) wafers using 2D and 3D automatic inspection. The patented GENIUS™ Automatic Self-Teach feature allows automatic wafer setup without requiring a process engineer to find and teach several good die manually for each device type. Reduces Customer Returns Improves Bump/Flip-Chip Process Decreases Inspection Time and Cost Reduces Initial Capital Investment Improves Probing Process Improves Inspection Reliability