Multiprobe
Vacuum Annealing System
FSM
900TC
The
FSM 900TC determines the thermal mechanical properties
of various low k and copper films.
The
FSM 900TC-vac Integrated Metrology Chamber has been
designed to eliminate problems with data interpretation
owing to sample to sample and tool to tool variations.
The chamber features simultaneous Stress Hysteresis,
Outgassing/Thermal Desorption Spectroscopy (TDS),
Film Shrinkage, Reflectivity, and Resistivity in
situ measurement (for a whole wafer), during a heat
cycle.
The system is based on an RTP type annealing chamber.
To simulate processes for low k and copper the system
can operate in high vacuum or under ambient inert
atmosphere (with less than 10 ppm partial pressure
oxygen) . Wafer sizes up to 300mm can be handled.
FSM
Laminar Quantitative Adhesion Tester
The adhesion test tool complements the FSM900TC
in characterizing the adhesion properties - Fracture
Toughness and Debond energy of the thin film stack.
The tool uses the MELT (modified edge lift off test)
method which is the industry's standard for quantifying
thin films in semiconductors. The tool determines
and compares the adhesive and cohesive properties
of new materials as a function of their processing
conditions.
