Wafer Thickness Mapper

FSM 413

The first optical based non-contact wafer thickness measurement system designed to monitor total thickness variation, TTV, of ultra-thin silicon or III-V based materials after the back-grind or chemical etching process.

The FSM 413 Wafer Thickness Mapper, from Frontier Semiconductor, uses a laser-based system to measure and map the thickness of ultra-thin wafers (less than 150 microns) despite the wafer being supported by tapes or other carrier support materials such as sapphire.

Ultra-thin wafer technology is ideal for the manufacture of smart cards, flash memories, 3D memory devices, smart labels and a range of portable consumer electronic products such as cell phones, PDAs and digital cameras.

The FSM 413 can gauge standard or bonded wafer thickness from 10mm down to 10 microns. The system's high-resolution optics also enable wafer thickness of bumped wafers to be measured after back-grind or chemical processes. Thickness of individual die on a sawn wafer left on a dicing frame can also be determined.

In certain optoelectronics or MEMs applications, the mapper system can profile the depth of etched wells and the remaining thickness of the bottom of the etched well to the other side of the wafer.

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