Frontier Semiconductor Measurements Inc offer a wide range of film stress, wafer bow and thickness measurement equipment which include:

Thick Film Stress & Flatness Measurement Systems

FSM 3800 C2C
The system provides automatic cassette to cassette wafer handling with throughput of 120 wafers/hr. The system measures stress, flatness, 3D, map and contour map. Dual wavelength, auto substrate thickness SECS/GEM and SMIF capability.

FSM 128
The FSM 128 is a reliable system that monitors stress and flatness under room temperature. Features include a repeatability of 1% (1 sigma), fast 3D map of wafer surface, dual laser, autocalibration and macro programming.

FSM 128L
The FSM 128L handles wafer sizes up to 300 mm for characterizing stress and flatness. Either manual or automated systems including FOUP. Features 3D as well as contour mapping of stress and flatness, auto dual laser switching for maximum flexibility and auto thickness measurement.

FSM 128G (FLAT PANEL)
The FSM 128G handles flat panels up to 550 x 650mm or larger. Features fast 3D and contour mapping over the entire glass panel. Equipped with an anti-static bar to eliminate static associated with large panels.

Multiprobe Vacuum Annealing System

FSM 900TC
The FSM 900TC determines the thermal mechanical properties of various low k and copper films.

The FSM 900TC-vac Integrated Metrology Chamber has been designed to eliminate problems with data interpretation owing to sample to sample and tool to tool variations. The chamber features simultaneous Stress Hysteresis, Outgassing/Thermal Desorption Spectroscopy (TDS), Film Shrinkage, Reflectivity, and Resistivity in situ measurement (for a whole wafer), during a heat cycle. The system is based on an RTP type annealing chamber. To simulate processes for low k and copper the system can operate in high vacuum or under ambient inert atmosphere (with less than 10 ppm partial pressure oxygen) . Wafer sizes up to 300mm can be handled.

FSM Laminar Quantitative Adhesion Tester
The adhesion test tool complements the FSM900TC in characterizing the adhesion properties - Fracture Toughness and Debond energy of the thin film stack. The tool uses the MELT (modified edge lift off test) method which is the industry's standard for quantifying thin films in semiconductors. The tool determines and compares the adhesive and cohesive properties of new materials as a function of their processing conditions.

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the FSM 413 Wafer Thickness Mapper