The
first-ever wireless, wafer-like leveling device,
Cyberoptics Semiconductor WaferSense ALS reduces
total cost of ownership by enabling fast and accurate
tool setup and maintenance and by providing data
required to relate tool levelness with yield.
The
system cuts
coplanarity adjustments to just a few minutes work.
WaferSense
ALS goes where wafers go, senses what wafers sense
and makes short work of fab coplanarity and leveling
adjustments.
In
a variety of wafer fabrication tools and equipment,
WaferSense ALS saves equipment downtime, reduces
maintenance manhours - typically by 80% - and optimizes
yields.
Vacuum-compatible,
the WaferSense sensor can be placed in FOUPs, cassettes,
load locks and other process equipment to wirelessly
transmit coplanarity data to a laptop with ±0.03
degree RMS accuracy.
WaferSense
ALS combines performance accuracy with an intuitive
'bubble' graphic (LevelView™) that provides the
user with real-time visual feedback to permit more
precise and efficient leveling adjustments than
possible with the human eye or a traditional bubble
level.
Features
